The Innovation
Conceived in Israel, bred in Zhongshan
Continuous roll-to-roll non-stop metal foil lamination directly to the substrate in a single pass.
In the first place we applied extrusion lamination method and matching heavy assets otherwise designed for flexible packaging.
The laminations speeds of 40-50 and above m/min are standard speeds in this industry.
Our Zhongshan based research/pilot manufacturing facility today is equipped with a dedicated custom-design multi-functional asset that covers high throughput with unique set of operational capabilities.
These include extrusion laminator, board 125 µm to 1.2 mm mono- and multi-layer extrusion, extrusion coating, glass cloth encapsulation, metal foil lamination and final product panelizing.
Leveling-panelizing machine breaking a 30 mil DS roll into 4-feet-long panels
Dielectric low-loss to extra-low-loss substrates based on either polyolefins (PO) or their blending with polyphenylene ether (PPE).
The recent 2-3 years brought us to a break through with finding proprietary modification capable extra-low-loss compositions.
Our customers in Israel, Russian Federation, India, etc. have applied the laminates for devices operation from sun-six to 43 GHz.
10 GHz dipole array fragment
17 GHz dipole array for most demanding airport and power station security applications in Russian Federation
Physical substrate cross-linking All of the above substrates were engineered for sheet extrusion, continuous lamination and physical on-the-run cross-linking with electron beam, gamma or UV irradiation.
Cross-linking is effectively partial conversion (modification) of thermoplastic polymer(s) into thermoset(s).
The e-beam induced polyolefin cross-linking brings about the proprietary very low-loss performance improved with the modification.
The mechanical properties of the cross-linking capable compositions ramp up.
Heat expansion, in particular, drops substantially.
Heat expansion and loss-factor improvements are proprietary to our research.
PRC leading e-beam accelerator manufacturer’s low beam energy product – one of these we apply for our polymer modification process.
Same state-owned facility, CGN, provides irradiation service of a medium and high-energy accelerators. These as well are well-applied in our process.
Multi-layer PCB structures got simplified with bonding with cross-linkable PO bond-plies engineered to match our substrates.
Interestingly, as the laminate both SS and DS are modified via electron-beam irradiation, the binding plies would not be modified to retain the high bonding ability. The final assemblies (multi-layer structures) are finally modified with low energy accelerators and the resulting modified sample is dipped into the solder bath.
Neither the shape, not the dielectric performance are affected.
Dipping a 3-layer BF-300-30 sandwich into a tub with molten SAC307 solder alloy – 260 degrees C
The polymer chemistry we developed with matching partners mostly in Israel has proven itself for over 20 years of field-service since the industrial consumption has started in Israel
It may apply via extrusion-lamination, hot-roll and hot-press-lamination.
Hot-roll lamination of 12 µm copper foil to a rolled aluminum substrate – most inexpensive technology and its product applied mostly for LED light industry.
Our research makes it applicable for the most demanding MW niche market.